Silicon carbide wafer fabrication facility at Rs 618 crore in Bhubaneswar targets production in Mar 2026

RIR Power Electronics has informed the Odisha government that its silicon carbide (SiC) wafer fabrication facility in Bhubaneswar is progressing as planned, with commercial production expected to begin by March 2026.  The project entails an investment of Rs 618 crore and is considered a key step in building India’s compound semiconductor ecosystem.

To further strengthen the state’s semiconductor landscape, the Odisha government has unveiled a revised policy offering attractive incentives. The policy promises benefits equivalent to 50 per cent of what the Centre provides, along with additional measures to nurture talent and innovation.

As part of the initiative, engineering students will receive around Rs 10,000 if they opt for semiconductor studies, with support also extended to develop and commercially launch their own chip designs.

On September 2, the government signed two major MoUs for electronics manufacturing projects, bringing in a combined investment of about Rs 2,655 crore. 

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These include TopTrack Hi-Tech PCB, which will establish an advanced PCB manufacturing facility with an investment of Rs 1,005 crore, and Sancode Technologies Limited, which, in collaboration with its global technology partners- Silicon Connect, Advanced Packaging Institute & Research Center (APIRC), and Inari Amertron Berhad, will set up a Rs 1,650 crore facility in the state.

With these projects, Odisha is positioning itself as an emerging hub for advanced semiconductor and electronics manufacturing in India.