3D Glass semiconductor packaging unit in Odisha: Intel CEO to visit soon

Odisha is set to witness a major boost in its semiconductor ecosystem as Intel CEO Lip-Bu Tan is expected to visit the state later this year for the foundation-laying ceremony of 3D Glass Solutions’ (3DGS) upcoming unit, a senior government official confirmed on Wednesday.

Principal Secretary of Electronics and IT Department, Vishal Kumar Dev, said that two landmark projects are lined up at InfoValley in Bhubaneswar. 

“SiCSem’s ground-breaking is planned for next month, while 3D Glass Solutions is awaiting a suitable date from Intel CEO Lip-Bu Tan, who has expressed willingness to attend the ceremony. We are hopeful it will take place within the next two to three months,” Dev told PTI.

SiCSem Private Ltd, in partnership with UK-based Clas-SiC Wafer Fab, is establishing India’s first compound semiconductor fabrication facility based on silicon carbide (SiC). The unit is expected to commence chip production within two years.

Meanwhile, the 3D Glass Solutions project will be developed by Heterogeneous Integration Packaging Solutions Pvt Ltd, backed by global technology leaders such as Intel, Lockheed Martin, and Applied Materials. With an investment of Rs 1,943 crore, the plant aims to achieve an annual output of 5 crore semiconductor units.

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These ventures mark Odisha’s entry into the high-tech semiconductor manufacturing space, with Intel’s involvement seen as a significant milestone for India’s electronics ecosystem.